|
Project |
The Preparation Process of Ultra-high Pure HF for Integrated Circuits |
|
Company |
PERIC |
|
Project |
The Key Technology Research and Development and Industrialization of Si2H6 |
|
Company |
ARGOSUN MO |
|
Project |
The Industrialization Technology of CMP Polishing Pad for 12 "Copper Wafer Process |
|
Company |
HUBEI DINGHUI |
|
Project |
The Industrialization Technology of 6N Grade Arsine and Phosphine for Integrated Circuits |
|
Company |
NATA |
|
Project |
The Complete Preparation Technology for Ultra-high Purity Copper Target for 300mm Wafer for Integrated Circuits |
|
Company |
GRIKIN |