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Congratulations on the successful Convening of the Standards Committee of the Integrated Circuit Material Industry Technology Innovation Alliance in 2021

Congratulations on the successful Convening of the Standards Committee of the Integrated Circuit Material Industry Technology Innovation Alliance in 2021

Source:
Darbond
2021/03/23
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Recently, the Standards Committee of the Integrated Circuit Materials Industry Technology Innovation Alliance (hereinafter referred to as the "ICMtia Standards Committee") held a committee re-election and the establishment of the CSTM/FC51 Integrated Circuit Materials Standardization Technical Committee in Shanghai.

Darbond Technology Co., Ltd. attended the meeting as a member of the new standard committee of the Material Alliance. With its technical advantages in the field of semiconductor electronic packaging materials, Darbond will continue to expand its influence in the field of semiconductor integrated circuits, The localization and standardization of integrated circuit manufacturing make a contribution.