As a crucial link in the semiconductor industry chain, materials and components are playing an important supporting role in industrial development. An industry consensus has been reached that is to adapt to the rapid development needs of China's semiconductor manufacturing industry and foster a local supply chain that is innovative, integrated, open and win-win.
The 2018 China Semiconductor Materials and Components Innovative Development Conference will bring together Chinese and foreign entrepreneurs, scholars, and experts involved in the support of integrated circuit manufacturing, packaging and test, OEM equipment, critical materials and components. These important segments of the industrial chain share interests in research on technology trends, market development and industrial opportunities. Working to facilitate the exchange between upstream and downstream parts of the supply-chain is critical to their success. This year’s conference will support the theme of close international cooperation to aid in accelerating and upgrading the materials and components supply-chains in support of the global semiconductor industry. As the dominant organizer, ICMtia is very pleased to have TECHCET and its CMC seminar in this collaborative effort. ICMtia and TECHCET have worked closely together to create an agenda that brings together a global perspective to inform both ICMtia and CMC members. It will be held in Ningbo, China from 29th-31st, October.
Instructors: Ningbo Municipal People`s Government
China Semiconductor Industry Association
China Integrated Circuit Industry Technology Innovation Strategic Alliance
Supporters：Ningbo Municipal Economic Information Technology Committee
Ningbo Science & Technology Bureau
Ningbo Municipal Development & Reform Commission
Sponsors: Integrated Circuit Materials & Components Industry Technology Innovative Alliance (ICMtia)
China Semiconductor Industry Association Support Industry Branch
Co-sponsor: People`s Government of Beilun
Ningbo Electronics Industrial Association
TECHCET/Critical Materials Council (CMC)
Time: 29th October-31st October, 2018
Venue: BODI Inshow International Hotel, Beilun District, Ningbo
Agenda：
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Date |
Time |
Content |
|
29th Oct |
Before 11:00 |
Registration |
|
12:00-14:00 |
Lunch |
|
|
14:30-17:30 |
Annual Enlarged Meeting of the ICMtia Council (closed) |
|
|
CMC training： |
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|
18:00-20:00 |
Buffet Dinner |
|
|
30th Oct |
09:00-09:30 |
Opening Ceremony【Host：Ying Shi】Speech delivery by leaders |
|
09:30-10:20 |
1、9:30-9:50 Shanghai Huali Microelectronics Corporation-President: Haibo Lei-【China's Chip Manufacturing Industry Development Prospects and Opportunities for Localization of Materials and Components】 |
|
|
10:30-10:45 |
Break |
|
|
10:45-12:00 |
Invited Report:Equipment and Materials【Host: Shumin Wang】 |
|
|
12:00-13:00 |
Buffet Lunch |
|
|
13:30-15:10 |
Invited Report:Materials and Component【Host: Chongying Xu】 |
|
|
15:10-15:25 |
Tea Break |
|
|
15:30-17:30 |
Invited Report: Packaging【Host: Lijun Yao】 |
|
|
18:00-20:00 |
Reception Banquet |
|
|
31st Oct |
09:00-09:10 |
CMC OPENING REMARKS CMC Seminar Chairman Dean Freeman |
|
09:10-10:15 |
Keynote Speech: Global Issues |
|
|
10:15-10:30 |
Break |
|
|
10:30-12:00 |
3.、10:30-11:00 Linggas（Tianjin） Ltd.-General Manager: Ma Li (Maria Ma)-【Developing Electronic Grade Materials in China for Global Customers】 |
|
|
12:00-13:30 |
Buffet Lunch |
|
|
13:30-15:00 |
Industrial Report：Logistics – Markets |
|
|
15:00-15:30 |
Tea Break |
|
|
15:30-17:00 |
4、15:15-15:45 VLSI Research.Inc- Sr. Technical & Market Analyst : Lin Fu, Ph.D -【Equipment Market Outlook & Component Market Segments】 |
|
|
18:00-20:00 |
Dinner |
|
|
1st Nov |
8:00-12:15 |
CMC Speed Dating【Close door】 |
|
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Departure（Ningbo Airport/Hangzhou Airport） |
Partnership：
Silver Partnership：
Brown Partnership：
