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2018 China Semiconductor Materials and Components Development Conference

2018 China Semiconductor Materials and Components Development Conference

Release time:
2021/01/18 09:53
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As a crucial link in the semiconductor industry chain, materials and components are playing an important supporting role in industrial development. An industry consensus has been reached that is to adapt to the rapid development needs of China's semiconductor manufacturing industry and foster a local supply chain that is innovative, integrated, open and win-win.

The 2018 China Semiconductor Materials and Components Innovative Development Conference will bring together Chinese and foreign entrepreneurs, scholars, and experts involved in the support of integrated circuit manufacturing, packaging and test, OEM equipment, critical materials and components. These important segments of the industrial chain share interests in research on technology trends, market development and industrial opportunities. Working to facilitate the exchange between upstream and downstream parts of the supply-chain is critical to their success. This year’s conference will support the theme of close international cooperation to aid in accelerating and upgrading the materials and components supply-chains in support of the global semiconductor industry. As the dominant organizer, ICMtia is very pleased to have TECHCET and its CMC seminar in this collaborative effort. ICMtia and TECHCET have worked closely together to create an agenda that brings together a global perspective to inform both ICMtia and CMC members. It will be held in Ningbo, China from 29th-31st, October.


Instructors:   Ningbo Municipal People`s Government

                    China Semiconductor Industry Association

                    China Integrated Circuit Industry Technology Innovation Strategic Alliance

Supporters:Ningbo Municipal Economic Information Technology Committee

                     Ningbo Science & Technology Bureau

                     Ningbo Municipal Development & Reform Commission

Sponsors:     Integrated Circuit Materials & Components Industry Technology Innovative  Alliance (ICMtia)

                     China Semiconductor Industry Association Support Industry Branch

Co-sponsor: People`s Government of Beilun

                     Ningbo Electronics Industrial Association

                    TECHCET/Critical Materials Council (CMC)

Time: 29th October-31st October, 2018

Venue: BODI Inshow International Hotel, Beilun District, Ningbo







29th Oct

Before 11:00





Annual Enlarged Meeting of the ICMtia Council (closed)

CMC training:
1、14:00-16:00 TECHCET/CMC- Sr. Market Analyst : Dan S Tracy ,Ph.D
TECHCET/CMC- Sr. Technical Analyst : Kuang-Han Ke , Ph.D
【TECHCET KSF Training: 1.Basic Semiconductor Training; 2.Marketing for Engineers;3. Supplier Quality Audit Preparation &Training】
16:00-17:00 Xiamen Phocus Semiconductor Technology Co. Ltd –General Manager: Weimin Li ,Ph.D
DFS- Director of R&D | Chemical Product Technology Manager: Karl Urquhart
【Precise Real Time Control of Chemical Composition】


Buffet Dinner

30th Oct


Opening Ceremony【Host:Ying Shi】Speech delivery by leaders


1、9:30-9:50 Shanghai Huali Microelectronics Corporation-President: Haibo Lei-【China's Chip Manufacturing Industry Development Prospects and Opportunities for Localization of Materials and Components】
2、9:50-10:10 Intel USA- Director, Supplier Technology and Industry Development, Global Supply Management of Intel Corporation : Steve Johnston ,Ph.D-【Positioning China’s Supply Chain for Success in an Interconnected, Data-Centric World】
3、10:10-10:30 VLSI Research Europe-Managing Director : John West-【Critical Subsystems and Components: Challenges and Opportunities for Chinese Suppliers】




Invited Report:Equipment and Materials【Host: Shumin Wang】
10:45-11:05 AMEC-Chairman/CEO: Zhiyao Yin ,Ph.D -【The Importance, Issues and Recommendations for the Development of Integrated Circuit Equipment and Materials Industries】
11:05-11:25 Lam Research- Asia Head of Supply Chain Operations : Nic Rossi , Ph.D -【Supply Chain Design For Scalability】
11:25-11:45 Merck Performance Materials Semiconductor Solutions-Global Head of R&D and Technical Services in a business field of Merck Semiconductor Solutions: Guangyang Lin ,Ph.D-【Photoresists and Photolithographic Process Enhancement Materials】


Buffet Lunch


Invited Report:Materials and Component【Host: Chongying Xu】
1、13:30-13:50 Versum Materials- General Manager of SP&C (Surface Preparation & Cleans) : Rick Chen ,Ph.D-【The Wafer Fab Cleans in Semiconductor Industry from a Materials Supplier Perspective】
2、13:50-14:10 Jiangsu NATA Opto-electronic Material Co., Ltd. –Vice President : Luping Wang , Ph.D -【The Development Prospective of Integrated Circuit Electronic Gas in China】
3、14:10-14:30 Anji Microelectronics (Shanghai) Co.,Ltd- Chairman/CEO : Shumin Wang ,Ph.D -【Critical Roles CMP Technology Plays in IC Industry Development】
14:30-14:50 Jiangsu Xinhua Semiconductor Materials Technology Co.,Ltd-General Manager: Xin Tian-【Market and Rearch of High Pure Semiconductor Polysilicon For Integrated Circuit Industry】
14:50-15:10 Hangzhou Cobtter Filtration Equipment Co.,Ltd-CEO: Yingmin Zhang-【IC Industry Application and Developement Nanofiltration Trends】


Tea Break


Invited Report: Packaging【Host: Lijun Yao】
15:30-15:50 ASM Pacific Technology-Senior Technical Advisor : John H. Lau ,Ph.D-【Materials Challenges for Flip Chip, WLCSP, and FOWLP】
7、15:50-16:10 Jiangsu Changjiang Electronics Technology Co., Ltd.-Senior Vice President:   Steve Liang ,Ph.D-【IC Packaging Technology Development Trend and Industry Chain Opportunities】
8、16:10-16:30 Ningbo HuaXin Electronic Technology Co., Ltd- Chairman: Fei Hua ,Ph.D-【Material Challenges and Opportunity for Advanced Semiconductor Packaging Technology of Emergence on Artificial Intelligence】
16:30-16:50 Yantai Darbond Technology Co., Ltd –General Manager : Tian`an (Tim) Chen ,Ph.D –【High Thermal Conductivity DA Adhesive and DA Film Development】
16:50-17:10 Shinhao Materials LLC.- Chairman/CEO : Yunzhang ,Ph.D -【Challenges and Opportunities for Advanced Packaging Materials in China-Electroplating Additives】
17:10-17:30-ICMtia-Secretary General : Ying Shi-【Final Report: The Development Prospective of Semiconductor Materials Industry in China】


Reception Banquet

31st Oct


CMC OPENING REMARKS  CMC Seminar Chairman Dean Freeman


Keynote Speech: Global Issues
1、9:15-9:45  ON Semiconductor -Strategic Sourcing Manager: Carlos Flores Padilla-【International Supply-Chain Management Challenges】
2、9:45-10:15 TECHCET/CMC- President /CEO : Lita Shon-Roy-【Global Materials Markets & Supply-Chains】




3.、10:30-11:00 Linggas(Tianjin) Ltd.-General Manager: Ma Li (Maria Ma)-【Developing Electronic Grade Materials in China for Global Customers】
4、11:00-11:30 Pall Filter (Beijing) Co., Ltd. -Vice President: David Huang ,Ph.D -【Defect Control and Filtration for Delivery of Quality Materials】
5、11:30-12:00 Entegris.Inc- Sr Director of Advanced Deposition : Charles Chen-【Deposition Materials - Past, Present and Future】


Buffet Lunch


Industrial Report:Logistics – Markets
1、13:30-14:00 Chemical Inspection and Regulation Service–Senior Chemical Regulatory Affairs Manager : Congyi(Lisa) Xu-【Changing Regulations in China Impacting Materials Supply-Chains】
2、14:00-14:30 TECHCET/CMC- Sr. Market Analyst : Dan S. Tracy , Ph.D-【Semiconductor Metal Markets and Applications】
3.、14:30-15:00 Piotech Limited-CEO : Brian Lu, Ph.D -【Semiconductor Equipment Supply Chain Inside /Outside of China】


Tea Break


4、15:15-15:45 VLSI Research.Inc- Sr. Technical & Market Analyst : Lin Fu, Ph.D -【Equipment Market Outlook & Component Market Segments】
5、15:45-16:15 SurplusGlobal- General Manager: Haihan(Jonathan) Shang-【Used 200mm Tools – Changing Market Dynamics】
6、16:15-16:45  TECHCET- Sr. Market Analyst : Dean W Freeman-【Silicon Wafer Market and Forecast, Rise of Chinese Wafer Suppliers, Tightness of Market Allow Them to Enter Market】
7、16:45-16:55 TECHCET/CMC: L. Shon-Roy 【Close Remarks】



1st  Nov


CMC Speed Dating【Close door】


Departure(Ningbo Airport/Hangzhou Airport)



Silver Partnership:


Brown Partnership: