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2017 China Semiconductor Materials and Components Development Conference

010-82358415

Quantum Core Block, No. 27, Zhichun Road, Haidian District, Beijing

2017 China Semiconductor Materials and Components Development Conference

Release time:
2021/01/18 08:53
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Date

Time

Content

29th Oct
(Monday)

Before 11:00

Registration

12:00-14:00

Lunch

14:30-17:30

Annual Enlarged Meeting of the ICMtia Council (closed)

CMC training  Topic: 1. Marketing for Engineers; 2. Basic Semiconductor device manufacturing                 

18:00-20:00

Buffet Dinner

30th Oct
(Tuesday)

09:00-09:30

Opening Ceremony【Host:Ying Shi 】Speech delivery by leaders(10 minutes per person)

09:30-10:20

Keynote Speech: Global Market【Host:Shumin Wang】(20 minutes for per person)
1.       9:30-9:50 Shanghai Huahong (Group) Co., Ltd -President Suxin Zhang【China's chip manufacturing industry development prospects and opportunities for localization of materials and components】
2.       9:50-10:10 Intel USA- Director, Supplier Technology and Industry Development, Global Supply Management of Intel Corporation  Dr.Steve Johnston【Positioning China’s supply chain for success in an interconnected, data-centric world】
3.       10:10-10:30 VLSI Research Europe-General Manager John West【Critical Subsystems and Components: Challenges and Opportunities for Chinese Suppliers】

10:30-10:45

Break

10:45-12:00

Invited Report:Equipment and Materials【Host: Shumin Wang】(20 minutes per person)
4.       10:45-11:05 AMEC-President Dr. Zhiyao Yin-Topic:Equipment(TBC)
5.       11:05-11:25 Lam Research- Asia Head of Supply Chain Operations Dr. Nick Rossi-【Supply Chain Design For Scalability】
6.       11:25-11:45 Merck Performance Materials Semiconductor Solutions-Global Head of R&D and Technical Services in a business field of Merck Semiconductor Solutions Dr. Guangyang Lin【Photoresists and Photolithographic Process Enhancement Materials】

12:00-13:00

Buffet Lunch

13:30-15:10 

Invited Report:Materials and Component【Host: Congying Xu】(20 minutes per person)
1.       13:30-13:50 Versum Materials Taiwan Branch- General Manager of SP&C (Surface Preparation & Cleans) SBU (Sub Business Unit)  Dr. Tianniu(Rick) Chen【The Wafer Fab Cleans in Semiconductor Industry from a Materials Supplier Perspective】
2.       13:50-14:10 Nata –Vice President Dr. Luping Wang-【Current Status and Prospect of China`s Integrated Circuit Electronic Gas】
3.       14:10-14:30 Anji Microelectronics (Shanghai)Co.,Ltd-President Dr. Shumin Wang-Topic:CMP 【Critical Roles CMP Technology Plays in IC Industry Development】
4.       14:30-14:50 Jiangsu Xinhua Semiconductor Materials Technology Co.,Ltd-General Manager Xin Tian-【Market and Rearch Of High Pure Semiconductor Polysilicon For Integrated Circuit Industry】
5.       14:50-15:10 Hangzhou Cobtter FiltrationEquipment Co.,Ltd-General Manager Yingmin Zhang-IC Industry Application and Developement Nanofiltration Trends】

15:10-15:25

Tea Break

15:30-17:30

Invited Report: Packaging【Host: Lijun Yao】(20 minutes per person)
6.       15:30-15:50 ASM Pacific Technology-Senior Technical Advisor Dr.Hancheng Liu(John H. Lau)【Materials Challenges for Flip Chip, WLCSP, and FOWLP】
7.       15:50-16:10 JECT-Senior Vice President Dr.Steve Liang【IC Packaging Technology Development Trend and Industry Chain Opportunities】
8.       16:10-16:30Ningbo HuaXin Electronic Technology Co., LTD-President Dr. Feihua【Material Challenges and Opportunity for advanced Semiconductor Packaging Technology of Emergence on Artificial Intelligence】
9.       16:30-16:50Yantai Darbond Technology Co., Ltd –General Manager Dr. Tian`an (Tim) Chen-Topic:Packaging Materials 【High Thermal Conductivity DA Adhesive and DA Film Development】
10.    16:50-17:10Shinhao Materials LLC.-President Dr. Yunzhang-【Challenges and Opportunities for Advanced Packaging Materials in China-Electroplating Additives】
11.    17:10-17:30-ICMtia-Secretary General Ying Shi-【Final Report】

18:00-20:00

Reception Banquet

31st Oct
(Wednesday)

09:00-09:15

CMC OPENING REMARKS

09:15-10:00

Keynote Speech: Global Issues
1 9:15-10:00  Semiconductor -Carlos Flores Padilla-International Supply-Chain Management Challenges】
2.10:00-10:30 TECHCET/CMC- President /CEO Lita Shon-Roy-Global Materials Markets & Supply-Chains】

10:30-11:00

Break

11:00-11:30

3. 11:00-11:30 Pall Filters-Vice President David Huang -Defect Control and Filtration for  Delivery of Quality Materials】
4. 11:30-12:00 Linggas Ltd.-General Manager Ma Li (Maria Ma)-【Developing Electronic Grade Materials in China for Global Customers】

12:00-13:00

Buffet Lunch

13:30-15:00 

Industrial Report:Logistics – Markets
1  14:00-14:30 CIRS –Senior Chemical Regulatory Affairs Manager Congyi(Lisa) Xu-【Changing Regulations in China Impacting Materials Supply-Chains】
2  14:30-15:00 Entegris- Sr Director of Advanced Deposition Charles Chen-【Supply-Chain Challenges - Case Study / Challenges of managing both local and global supply chains from a International Precursor supplier's perspective】

15:00-15:30

Tea Break

15:30-17:15

3  15:30-16:00 VLSI Research- Sr. Market Analyst Dr.Lin Fu-【Equipment Market Outlook & Component Market Segments】
4  16:00-16:30 Piotech-CEO Dr.Brian Lu-【Semiconductor equipment supply Chain  inside /outside of China】
5  16:30-17:00 SurplusGlobal- General Manager Haihan(Jonathan) Shang-【Used 200mm tools – changing market dynamics】
6  17:00-17:15 TECHCET- Sr. Market Analyst Dean Freeman-【Silicon Wafer market and forecast, rise of Chinese wafer suppliers, tightness of market allow them to enter market】

18:00-20:00

Dinner: CMC Cocktail& Sit-down dinner. Others: Buffet dinner

1st  Nov
(Thursday)

8:00-12:15

CMC Speed Dating【Close door】

2nd  Nov
(Friday)

 

Departure(Ningbo Airport/Hangzhou Airport)