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TSHT : Acquisite the Pacaking and Test Technology for 5nm Chips

TSHT : Acquisite the Pacaking and Test Technology for 5nm Chips

Source:
2020/10/16
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Recently, the Nanjing branch of Tianshui Huatian Technology Co.,LTD has formally stated  to producting. The company is a professional IC compony for packaging and testing and has the packaging and testing capabilities for 5nm chips.

In July of this year, Huatian Nanjing Advanced IC Packaging and Testing Industry Base project held a commissioning ceremony in the plant area of Nanjing Pukou Economic Development Zone.
  According to the data, Huatian Technology is mainly engaged in semiconductor integrated circuit packaging and testing business. At present, the company's integrated circuit packaging products mainly include DIP/SDIP, SOT, SOP, SSOP, TSSOP/ETSSOP, QFP/LQFP/TQFP, QFN/DFN, BGA/LGA, FC, MCM (MCP), SiP, WLP, TSV, Bumping , MEMS and other series, products are mainly used in computers, network communications, consumer electronics and smart mobile terminals, Internet of Things, industrial automation control, automotive electronics and other electronic complete machines and intelligent fields.