In recent years, the development of information technologies such as 5G and artificial intelligence has been growing the new opportunities to the integrated circuit industry, while the worldwide epidemic outbreak of COVID-19 brings trouble to the global semiconductor manufacturing. The semiconductor materials industry is facing a challenge unparalleled. We need to consensus that the entire semiconductor industry should cooperate closely, and also coordinating the supply chain. Meanwhile the enterprises should enhance the ability to keep developing in uncertainty.
Guided by National Major Project Administration Office (02 Project), Hefei Municipal People`s Government, China Semiconductor Industry Association, and China Integrated Circuit Innovative Alliance, hosted by National Major Project Panel (02 Project), The Integrated Circuit Materials Innovative Alliance(hereafter “ICMtia”), and China Semiconductor Industry Association Support Industry Branch, and co-organized by Hefei Development and Reform Commission, Hefei Investment Promotion Bureau, and Xinzhan High-tech Industrial Zone Management Committee, “2020 China Semiconductor Materials Innovation and Development Conference”, theming with new situation, new challenges and new breakthrough, was successfully held in Hefei, Anhui on September 14–September 16, 2020.
Jianlin Cao, Former Vice Minister, MOST and Chairman of China Integrated Circuit Innovation Alliance, Aihua Yu, Standing Committee Member of Anhui Provincial Party Committee and Secretary of Hefei Municipal Party Committee, Gang Qiu, Deputy Director of Department of Major Science and Technology Project, MOST, Xudong Yang, Deputy Director, Department of Electronic Information, Ministry of Industry and Information Technology of PRC, Wensong Wang, Deputy Mayor and Member of the Standing Committee of the Hefei Municipal Party Committee, Tianchun Ye, Chief Technical Officer of 02 Major Project, Director, Institute of Microelectronics, Chinese Academy of Sciences and Vice Chairman and Secretary General of China Integrated Circuit Innovation Alliance, Wenbin Ke, Deputy Director and Member of the CPC Leadership Group of the Department of Economics and Information Technology of Anhui Province, Ge Wei, Secretary General and Member of the Standing Committee of the Hefei Municipal Party Committee and other leaders participated in the opening ceremony.
Vice Mayor Wensong Wang, on behalf of the Hefei Municipal Government, sincerely welcomes all leaders and guests attending the conference, and warmly introduced Hefei as the sub-central city of the world-class city cluster in the Yangtze River Delta, a strategic dual-node city of "One Belt One Road" and the Yangtze River Economic Belt, which will vigorously promote technological innovation, and strive to create an industrial highland of "Chips, Screen and Device". As a country's most important device, integrated circuits are in a priority development position, and integrated circuit materials are a key link in the industry. He emphasized that under the dual impact of the global situation and the new crown epidemic, the development of the materials industry needs more encouragement and support. Hefei will further support policies on industries and talents, provide enterprises with efficient and high-quality services, and go hand in hand with the material industry for common development.
Tianchun Ye, Chief Technical Officer of 02 Major Project, Director, Institute of Microelectronics, Chinese Academy of Sciences and Vice Chairman and Secretary General of China Integrated Circuit Innovation Alliance, reviewed the difficult situation faced by materials companies 12 years ago, and pointed out that with the strong support of the government and the joint efforts of companies, our integrated circuit materials industry has achieved rapid development today. It is hoped that entrepreneurs will seize new opportunities and make new breakthroughs under the new situation and new challenges, adhere to global cooperation and development, focus on products and customers, strengthen technological innovation and enhance industrial competitiveness.
Xudong Yang, Deputy Director, Department of Electronic Information, Ministry of Industry and Information Technology of PRC, pointed out that semiconductor is a national strategic industry, and materials are in the upper reaches of the industrial chain, occupying a strategic core position. He emphasized that in August this year, the State Council issued a document to promote the development of the integrated circuit industry. As long as international and domestic enterprises meet the conditions, they will be supported by preferential policies. It is hoped that entrepreneurs will seize the broad market space and development opportunities to achieve higher-quality development of the semiconductor materials industry, and welcome multinational companies to build factories in China and jointly build a global semiconductor industry supply chain.
Jianlin Cao, Former Vice Minister, MOST, mentioned in his speech that the material industry is extremely important. The main characteristics of the integrated circuit industry are a generation of products, a generation of technology, and a generation of equipment. The cornerstone of the integrated circuit industry is a generation of materials. He also emphasized that the advanced materials industry at the beginning of the industrial chain needs strong support from the government, and he hopes that Hefei will become the first domestic industrial base where advanced materials are applied and promoted.
Roast Chairman of ICMtia, Lijun Yao, Deputy Chairman and General Secretary, Ying Shi and Chairman of Anji Microelectronics, Dr. Shumin Wang, Deputy General Manager of Nata, Dr. Chongying Xu hosted the conference.
Shaojun Wei, Chief Leader of National 01 Major Project, Vincent Gu, Chief Analyst of IC wise, HC Tsai, President of Nexchip, Yaobin Feng, General Manager of Lithography Technology Department of YMTC, Li Zheng, Chief Executive Officer of JCET Group were invited to make excellent keynote speeches.
Combined with the new challenges for the global semiconductor industry under the new situation, new trends in the development of the material industry, and new demands from technology and markets, Chinese and foreign entrepreneurs, experts, and scholars who come from the industries of integrated circuit manufacturing, packaging and testing, equipment manufacturing, and key materials will gather together to discuss how to deepen the integration of the global industrial chain, strengthen the coordination of the local supply chain, and consolidate the comprehensive strength of local materials companies to provide solid support for the sustainable development of the semiconductor manufacturing industry. Besides, the conference also held the first IC material awards award ceremony, as well as the signing ceremony of key projects in Hefei and the unveiling ceremony of the "Semiconductor Materials Industrial Park" in Hefei Xinzhan District.
Dr. Shaojun Wei, Chief Leader of National 01 Major Project made a speech on A Pragmatic View of the Current IC Industry. He analyzed the status que of the current IC industry in China, and pointed out that the COVID-19 will have a profound and lasting impact on the integrated circuit industry. The global semiconductor market is facing uncertain challenges. It is recommended that the Chinese government must be determined to continue to support the development of the integrated circuit industry, and our IC companies must humbly learn from their international counterparts and work together to promote the development of China's integrated circuit industry.
Dr. Vincent Gu, chief analyst of IC wise, analyzed in his speech Insights on the Development of China Semiconductor Industry in the New Situation that the new situation of China's integrated circuit industry and suggested to increase effective investment in the integrated circuit industry to promote the long-term sustainability of the industry development.
President of Nexchip, HC Tsai, made a speech on Nexchip - Devoting to Material Sourcing Localization. He mainly introduced the current situation of Nexchip in 2020 and the company's capacity plan. It is pointed out that the company will actively promote the localization of raw materials in order to meet customer needs, rapidly increase production capacity, continue to promote advanced technology, and strengthen intelligent manufacturing.
Yaobin Feng, General Manager of Lithography Technology Department of YMTC made a speech on Fostering a Collaborative Ecosystem to Accelerate Industrial Prosperity. He introduced the current status and development trend of the global and domestic memory industry, and pointed out that the IDM model will put forward higher requirements on the comprehensive capability of the industrial chain. He emphasized that the development of China's semiconductor industry cannot be separated from the coordination of the global industrial chain, and the general trend of international cooperation will be irreversible. It is hoped that based on serving customers around the world, we will achieve extensive cooperation with global strategic partners to promote the sound development of the industry ecology.
Li Zheng, Chief Executive Officer of JCET Group made a speech on Advanced Manufacturing Technologies Boost Semiconductor Materials Innovation. He pointed out that emerging applications will drive the innovative development of integrated circuit packaging towards high-density and high-precision. He also emphasized the growing importance of the collaborative design of chip circuits-packaging technology-materials-systems. JCET Group will be willing to assist material manufacturers in innovation and in-depth R&D collaboration.
The conference held the first IC material awards ceremony. Chief Leader Tianchun Ye and Director Jun Yang respectively presented 36 items to the corporate and individual winners, including Technology Research Award, Best Cooperation Award, Best Contribution Award, Emerging Enterprise Award, Best Growth Award and Five-Star Product.
China General manager of Lithography Technology, Semiconductor Technolog, Dupont, Dr.Zhijian Lu, Director of Laboratory of Nano Materials and Devices, SIMIT, Dr.Zhitang Song, CEO of Kempur Microelectronics Inc. Cindy Chen, Senior Technical Director of Grikin Advanced Materials Co., Ltd., Dr. Junfeng Luo, General Manager Assistant of Hubei Sinophorus Electronic Materials Co., Ltd., Huidong Cui, R&D Manager of Jiangsu HHCK Advanced Materials Co., LTD., Wei Tan, Senior Engineer of Shengyi Technology (Suzhou) Co., LTD, Shenggao Xiao, CTO of Hangzhou Cobetter Filtration Equipment Co.,Ltd, Yoshiaki Yamada, Sr. Market Analyst of TECHCET CA.LLC., Dan S.Tracy were invited to made excellent speeches. From international to domestic, from the development of new devices, advanced manufacturing processes to technological breakthroughs and industrialization of materials, the invited speakers comprehensively explored the impact of the slowdown in global economic development and the increase in uncertainty on the semiconductor industry, and emphasized the promotion of collaborative innovation in the industrial chain and the importance to the development of the semiconductor industry.
On September 16, the conference organized Investment Forum of Xinzhan High-tech Industrial Zone (Invited) and Supply Chain Connection Forum in Hefei Xinzhan High-tech Industrial Zone. The government of Hefei Xinzhan High-tech Industrial Zone is planning to build a "Semiconductor Material Industrial Park" basement in Hefei and radiating the Yangtze River Delta, and will provide semiconductor material companies with supporting preferential policies and quick approval measures. It is hoped that high-quality semiconductor materials companies will take root in Hefei Xinzhan High-tech Industrial Zone.
Domestic manufacturing companies, like Nexchip, CXMT, YDME, YMTC, CorEnergy, TFME， CR MICRO, United Semi, JHICC, and XTH ZHONGHUAN had a face-to-face exchanges with more than 60 Chinese and foreign material suppliers. The connecting forum played a positive role in deepening the understanding and promoting the cooperation between suppliers and users.
At the same time, the 2020 General Assembly of ICMtia and the fourth council of the third session were held. A total of more than 100 representatives attended the meeting.
The secretariat reported on the work of ICMtia in the first half of 2020. The conference conducted a number of discussions and votes on the alliance, and five companies were approved to become the Alliance member, including Xuzhou Xinjing Semiconductor Technology Co. LTD、DK Electronic Materials, Inc. (DKEM), Zhejiang Honxin Semiconductor Co. LTD, Shanghai Sijin Precision Technology Co., LTD、ASMC Semiconductor.