On April 2015,NCAP China, which focuses on system-level packaging and integration of pilot technology R & D and industrialization, and a leading international ASIC design company and a one-stop service provider Brite Semiconductor (Shanghai) Co., Ltd., officially signed the SoC and SiP technical cooperation agreement. The two companies will fully cooperate in innovative system-level packaging solutions such as high-performance Flip Chip Ball Grid Array (FCBGA) and high-density three-dimensional system-in-package (3D-SiP, including TSV).
NCAP China and Brite Semiconductor Jointly Create a New Generation of SoC and SiP Solutions
"Runma Electronics" Foundation Project Received Acceptance
Academician Lu Yongxiang investigates KFMI