The Joint Project of CETC and HWATSING Received Support from 02 Project

    The project is a sub-project of the National Science and Technology Major Special Project "Very Large Scale Integrated Circuit Manufacturing Equipment and Complete Process" (02 Special Project). The project implementation period is 2015-2018. It will develop 300mm wafers 28-14nm "dry in dry out" CMP machine equipment and a complete set of technology combined with supporting materials, and achieve industrialization, it is expected that product performance indicators will reach international advanced levels.