Shenzhen Institute of Chinese Academy of Sciences Has Made New Progress in the Research of Thermal Management of Electronic Packaging Materials

    The Guangdong Advanced Electronic Packaging Materials Innovation Research Team led by Academician Wang Zhengping and Researcher Sun Rong of the Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, made new breakthroughs in the thermal management of electronic packaging materials. The related paper "Ice-Templated Assembly Strategy to Construct "3D Boron Nitride Nanosheet Networks in Polymer Composites for Thermal Conductivity Improvement" was published online in the authoritative journal Small (DOI: 10.1002 / smll.201502173) in the field of materials.