Contact Us       中文

Search

1

1

 
>
Shanghai Sinyang's "65-45nm Chip Copper Interconnect Ultra-High Purity Plating Solution and Additives R & D and Industrialization" Project Passed Acceptance

Shanghai Sinyang's "65-45nm Chip Copper Interconnect Ultra-High Purity Plating Solution and Additives R & D and Industrialization" Project Passed Acceptance

Source:
2016/01/05
Page view

   

    On December 28, 2015, the formal acceptance meeting of the "65-45nm chip copper interconnect ultra-high purity plating solution and additives R & D and industrialization" project undertaken by Shanghai Sinyang was held at the company. This acceptance meeting will be convened and organized by the National Science and Technology Major Project "Very Large Scale Integrated Circuit Manufacturing Equipment and Complete Process Special Project" ("02 Special Project") Implementation Management Office.