On the morning of November 8, KFMI and American Gabor Microelectronics Materials Co., Ltd. held a signing ceremony at the Shanghai New International Expo Center, and officially announced that they will operate on mechanical polishing (CMP) polishing pads for semiconductor integrated circuits.
Dr. Yao Lijun, Chairman of KFMI, and Mr. David H. Li, President and CEO of Gabor, signed the agreement on behalf of the two companies. Secretary General Shi Ying of the ICMTIA witnessed the signing ceremony.
