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2017 China Flattening Technology Conference and Cross-Strait Flattening Technology Forum (Dalian, May 22-23, 2017) Notice of Mee

2017 China Flattening Technology Conference and Cross-Strait Flattening Technology Forum (Dalian, May 22-23, 2017) Notice of Mee

Source:
2017/03/27
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The Cross-Strait Flattening Technology Seminar aims to promote cross-strait flattening technology exchanges, cooperation between the deep chemical industry and the industry, and improve the level of cross-strait flattening technology. It has been held for five times since 2012. The 2017 Cross-Strait Flattening Technology Forum will be held at Dalian University of Technology from May 22nd to 23rd. This seminar will invite enterprises, universities and research institutes related to the flattening technology across the Taiwan Strait to participate in the academic exchanges on the development status and trends of the flattening technology, jointly improve the research level and technical level of the flattening technology, and promote relevant Industrial Development. The conference will be a grand gathering of academics and industry in the field of flat technology, and welcomes the extensive participation of academics and industry colleagues. The conference will collect a wide range of papers on the field of flattening technology (the deadline for submission is April 5, 2017).
 
Time: May 22~23, 2017.
 
Venue: Dalian University of Technology International Conference Center
 
Topic: The latest achievements and progress in flattening technology, including;
 
Flattening/polishing technique mechanism;
 
CMP process modeling, simulation and optimization;
 
Flattening/polishing process technology for hard and brittle materials;
 
CMP measurement technology;
 
Key materials and components for CMP processes;
 
Post-CMP cleaning and defect suppression process;
 
CMP process integration and control technology;
 
New demands for CMP technology in industrial development;
 
New principles and new technologies for flattening/polishing;
 
Organizer: Flattening Technology Alliance (CMPUG-CN), Micro-Nano Manufacturing Tribology Professional Committee
 
Organizer: Dalian University of Technology
 
Sponsors: Special sponsors are provided to relevant companies and companies. The organizer of the conference sets up booths for sponsors, and can use the essay advertisement layout to promote products.
 
Invited reporting unit: The conference will invite Dalian University of Technology, Fujian Jingan Optoelectronics, Fudan University, Hebei University of Technology, Huaqiao University, Intel, Linx consulting, Nanjing University of Aeronautics and Astronautics, Qinyi University of Science and Technology, Tsinghua University, Taiwan University of Science and Technology, Southwest Traffic Scholars from universities and other institutions have invited reports.
 
Chairman of the Organizing Committee: Lu Xinchun (Tsinghua University)
 
Vice Chairman: Qu Xinping (Fudan University), Professor Chen Yuzhang (Taiwan University of Science and Technology)
 
Members: Wang Yuchun (Anji Microelectronics), Zhang Baoguo (Hebei University of Technology), Ge Jun (SMIC),
 
Yang Tao (Microelectronics Institute of Chinese Academy of Sciences), Liu Bin (45 in CLP), Shangguan Dongsheng (Huajin Semiconductor),
 
Liu Weili (Shanghai Xinanna), Kang Renke (Dalian University of Technology), Lei Hong (Shanghai University),
 
Zhang Lijuan (Time Lifu), Wang Xueze (Jiangfeng Electronics), Zhou Hua (Jiangfeng Precision),
 
Zhang Yuliang (Tianjin University of Technology), Pan Guoshun (Shenzhen Lihe), Wang Tongqing (Tsinghua University),
 
Zhou Ping (Dalian University of Technology)
 
Secretary General: Zhou Ping (Dalian University of Technology)
 
Secretariat: Key Laboratory of Precision and Special Processing, Ministry of Education, Dalian University of Technology
 
Contact person: Yan Ying, yycmp2017@163.com, mobile phone: 15140697605
 
Zhou Ping, pzhou@dlut.edu.cn, mobile phone: 13478754767
 
Submission instructions: The proceedings of this conference are not publicly published. The organizing committee arranges oral reports or posts reports according to the abstracts or full texts submitted. Participants who are prepared to make oral reports must provide more detailed research materials to improve the organization of oral reports. The possibility of the deadline is April 5th, and the specific arrangement will be sent back before April 20.
 
Meeting schedule: (The specific schedule will be released before the meeting)

 

  5.22 5.23
morning

Invited Report & General Report

 

in the afternoon

Invited Report & General Report

Intel技术参观

(Factory & Culture)

 

Registration fee: Return to the meeting receipt before April 20 and pay registration fee: 1500 yuan / person, student 800 yuan / person. After April 20, the registration fee will be raised to: 1,600 yuan / person, student 900 yuan / person. Including the venue, catering, materials and other expenses. It is recommended to pay by remittance, and provide invoices on the spot (if the payment is made on site, the receipt can only be provided first, and the invoice will be sent out after the meeting).
 
Remittance Account:
 
Account Name: Dalian University of Technology Bank Account: China Construction Bank Dalian City Jinjin Branch
 
Account Opening Account: 21201501910050000923 Please be sure to indicate "CMP+Name" when remittance.

 

Meeting back

 

company name  
Name

Job title

cellphone number E-mail
Whether to report
 
(a summary is provided)

Whether to publish a paper