On December 11, 2018, the 1st Global IC Entrepreneur Conference & the 16th China International Semiconductor Expo (IC China 2018)" was grandly opened in Shanghai. It was organized by the Ministry of Industry and Information Technology and the Shanghai Municipal People's Government, sponsored by China Semiconductor Industry Association and China Electronics and Information Industry Development Research Institute, Beijing CCID Exhibition Co., Ltd., China Electronics News, and Shanghai IC Industry Association. Ying Shi, Secretary-General of the Supporting Industry Branch of China Semiconductor Industry Association and Secretary General of Integrated Circuit Materials and Components Industry Technology Innovation Strategy Alliance, was invited to attend the conference and co-chaired the innovation development sub-forum of IC industry chain with Xiekang Yu, Vice Chairman of China Semiconductor Industry Association.
The sub-forum was organized by the China Semiconductor Association's Integrated Circuit Branch and the Supporting Industry Branch, with the theme of “Building a Technology Innovation Chain to Enhance Industrial Competitiveness”. A number of leading managers and industry experts from well-known enterprises in related fields gathered to discuss how to promote the innovation and development of the industrial chain, the changes in the market structure under the new situation, and the direction of corporate development.
Lijun Yao, Chairman of Konfoong Materials International Co.,Ltd, Liqiang Cao, General Manager of National Center for Advanced Packaging Co., Ltd., and Gang Chen, General Manager of GrandiT Co., Ltd., made keynote speech on “Focusing on Strategic Opportunities, Establishing Core Competitiveness”, "Building a Technology Innovation Chain for Packaging and Testing Industry, Helping the Innovative Development of Enterprise” and “New Pattern of China`s Electronic Chemical Materials in the New Situation——Electronic Gas and Electronic Wet Chemicals”.
Secretary-General of ICMTIA Ying Shi