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Integrated Circuit Materials and Components Alliance Group Standards Review Meeting Held in Beijing

Integrated Circuit Materials and Components Alliance Group Standards Review Meeting Held in Beijing

Source:
2019/01/14
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    On January 10, 2019, Group Standard Review Meeting was held by Standard Committee of Integrated Circuit Materials and Components Industry Technology Innovation Alliance (Hereinafter”ICMTIA”) in Beijing.

    The meeting was presided over by Bing Liu, director of the Standards Committee. The experts of the review team and the leaders of some relevant units and engineering and technical personnel attended the meeting.The meeting reviewed the Specification of Integrated Circuit Materials and Components Industry Technology Innovation Alliance for Gas, which was filed by ICMTIA and drafted by the China Shipbuilding Industry Corporation 718 Institute and Jiangsu Nata Opto-Electronic Materials Co., Ltd. and two draft Group Standard Hydrogen peroxide for Integrated Circuit Materials and Components Industry Technology Innovation Alliance written by Suzhou Crystal Clear Chemical Co., Ltd.Chemical Group Co., Ltd. and Liming Chemical Research and Design Institute Co., Ltd.

 

    After listening the report from the standard drafting units, the experts of the review team conducted a rigorous and detailed review and heated discussion on the draft standards one by one, and proposed many feasible amendments.

 

    The entire process strictly followed the ICMTIA Standards Committee's Standard Formulation Procedures, and the review team finally voted to pass the Specification of Integrated Circuit Materials and Components Industry Technology Innovation Alliance for Gas and Hydrogen peroxide for Integrated Circuit Materials and Components Industry Technology Innovation Alliance and formed a standard approval draft according to the opinions of the review team.

 

    At last but not the least, the meeting also discussed the adoption of nine group standard proposals, covering electronic gases, process chemicals, targets and packaging materials.