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The Second and Third Sessions of the Alliance Council and General Assembly Successfully Held in Beijing

The Second and Third Sessions of the Alliance Council and General Assembly Successfully Held in Beijing

Source:
2019/01/15
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    On January 11, 2019, the General Assembly of Integrated Circuit Materials and Components Alliance (hereinafter referred to as the "Alliance") was successfully held at the Beijing Convention Center. A total of more than 150 people attended the meeting, including Deputy Inspector of Major Department of Science and Technology Department Gang Qiu, 02 Special Chief Engineer / Director of Microelectronics Institute of Chinese Academy of Sciences Tianchun Ye, Academician Deren Yang of Zhejiang University, Chairman of the Alliance / Vice President of SMIC Xin Zhang, Chairman of Zhongguancun Materials Alliance / Shanghai Integrated Circuit Yuhang Zhao, Chairman of the R&D Center, and Ying Shi, Secretary-General of the Alliance. The meeting summarized the work of the second council in 2015-2018, and considered and voted on the alliance stripping parts business and the Zhongguancun Materials Alliance to absorb the new members. During the same period, the Council held the reelection of the Board of Directors and held the third session of the Board of Directors and the General Assembly. The work of the Third Council and the 2019 work plan were discussed.

    On the morning of the 11th, Secretary-General Ying Shi made a report on the work of the Second Union Council (2015-2018). The relevant staff of the Secretariat made a financial work report, C-MRS work report, group standard and quality assessment work report. Zhenlin Lei, chairman of the Shenyang Institute of Science and Technology of the Chinese Academy of Sciences, made a report on the work of the component sector, and Yuming Liu made a report on the supervisor. Participants held a lively discussion on the second session of the Council's work report.

Secretary-General of ICmtia Ying Shi

    02 Special Advisor, Secretary General of the IC Industry Technology Innovation Strategy Alliance Tianchun Ye pointed out in the meeting that among the professional alliances of the IC industry technology innovation strategic alliance, the material alliance`s performance is very outstanding, and the work is active and fruitful. The recent Sino-US trade friction brings opportunities and worries, but for the material industry, opportunities weigh more. He hoped that the material alliance can further build a better platform to unite the strength of the industry, jointly explore innovative ideas for 2030, seize market opportunities, promote the overall growth of materials companies, form the overall strength of the national integrated circuit materials industry, and continuously expand market share.

 02 Special Advisor, Secretary General of the IC Industry Technology Innovation Strategy Alliance Tianchun Ye 

    Gang Qiu, deputy inspector of the Major Special Projects Department of the Ministry of Science and Technology and deputy director of the 02 Special Implementation Management Office, pointed out at the meeting that the material alliance for 2035 should form close support with the industrial layout, and fully play the characteristics of the alliance in promoting the combination of industrial technology innovation and market mechanisms. Director Qiu also said that the Major Special Division and the 02 Special Office will continue to support the Alliance's work in order to promote the early emergence of large and strong internationally competitive enterprises in the materials industry. In order to make the material sector develop better, Director Qiu proposed to separate the parts business from the alliance and develop it separately. The suggestion was approved by all the participants.

Deputy Inspector of the Major Special Projects Department of the Ministry of Science and Technology  Gang Qiu

    The deputy director of the Alliance Expert Advisory Committee and Academician Deren Yang of Zhejiang University said that they will do a better job under the leadership of the Alliance. As the expert of the 02 special group, they will make the best efforts and contributions for the national integrated circuit materials industry.

Academician Deren Yang

    On the afternoon of the 11th, the third session of the board of directors was reelected. The delegates actively participated in and voted for their sacred votes, and finally elected 54 members of the third board of directors, and Ying Shi was re-elected as the executive vice president and secretary general.

Voting

Counting

    The meeting also voted through the Zhongguancun Materials Alliance Modification Regulation, fees and the third amendment to the Agreement, and discussed and announced the name list of expert advisory committees. Four new affiliates were reviewed and approved and the components enterprises were spun off from the alliance.

    After the completion of the general election, Secretary-General Ying Shi made the third session of the Council's work priorities and the 2019 work plan report, and proposed that the focus of work in 2019 will focus on seven aspects, including supporting the work of the 02 special materials sector, promoting cooperation between supply and demand, improving mass production applications, organizing industry and academic exchange activities, promoting international cooperation, industrial planning policy recommendations, deepening intellectual property research and standardization work, and industrial operation data collection and trend analysis. She also stressed that the focus will be on systematically solving the problems of material industrialization competitiveness and joint development of new materials technology.

    The Director of third session Xin Zhang said that the alliance has laid a very good foundation under the vigorous development in recent years, and will play a greater role in the development of the integrated circuit industry.

Director of third session Xin Zhang

    Yuhang Zhao, chairman of the Zhongguancun Alliance, summed up the rich and effective work of the alliance. In the future, the alliance will unite the upstream and downstream enterprises, develop the group, and launch practical solutions to practical problems to promote the healthy and rapid development of the integrated circuit materials industry.

Chairman of the Zhongguancun Alliance Yuhang Zhao

    The delegates had a lively discussion on the next work of the alliance and placed high expectations on the third council.