The 2019 China Semiconductor Materials Innovative Development Conference will be held in Ningbo on September 10-11, 2019.
During the China Semiconductor Materials Innovation and Development Conference, Chinese and international entrepreneurs, experts and scholars working in the field of semiconductor industry, including wafer processing, packaging assembly and testing, etc., will gather together to discuss how to deepen domestic and international cooperation, accelerate technology development, and promote ecological development. A series of activities will be launched to enhance the exchange between upstream and downstream of the supplier chain, and also build a bridge between enterprises and local governments.
We are now extending sincere invitation to you.
Now the registration of the Conference is open.
Location: Radisson Beilun Ningbo
No.1288 Baoshan Road, Beilun District, Ningbo
Date: September 10 – September 11, 2019
Agenda:
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September 9 Monday |
Afternoon |
Registration |
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September 10 Tuesday |
9:00-9:30 |
Opening Ceremony |
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9:30-12:00 |
Keynotes |
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12:00-13:30 |
Lunch |
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13:30-17:30 |
Invited Talks Final Report |
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18:00-20:00 |
Reception |
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September 11 Wednesday |
8:30-12:00 |
Invited Events: 1.Supplier and Customer connection forum 2.Key topic discussion Forum |
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12:00-13:00 |
Lunch |
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13:30-16:00 |
Alliance Council Meeting（Closed） |
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Departure |
Organizers: Integrated Circuit Materials Industry Technology Innovation Alliance
China Semiconductor Industry Association Support Industry Branch
Co-organizers: Beilun District People`s Government of Ningbo Municipality
Ningbo Electronic Industry Association
Registration Address: http://nh.icmtia.com/index.php/nhzc.html
Deadline: August 31, 2019
Charge: ICMtia membership and partner membership: ￥1500 RMB/per person
Non-membership:￥2200 /per person，before July 20;
￥2600/ per person，from July 21.
Please refer tohttp://nh.icmtia.com/index.php/nh.html for details.