On the afternoon of October 29, 2018, the second-session ninth council of the Strategic Alliance for Technological Innovation of Integrated Circuit Materials and Components Industry (hereinafter referred as the Alliance) was held in Ningbo. More than 110 representatives of the secretary-general, vice director general, standing directors and member units of the Alliance and the newly applied member units attended the meeting. Secretary general Shi Ying presided over the meeting.
The meeting affirmed the Alliance's achievements and progress made in supporting 02 special material project, formulating the road map for the technology development of integrated circuit material industry, organizing industrial docking and academic exchange activities, and made in intellectual property research, data acquisition and industrial operation analysis, standardization of alliance groups, participation in the compilation of Comprehensive Volume on Integrated Circuit Industry, and so on. The work for the second half of 2018 were discussed at the meeting. The meeting informed that Technology Innovation Strategic Alliance for Zhongguancun Integrated Circuit Material and Components Industry was officially registered. All members of the Alliance voted by raising their hands to transfer their membership directly to the Alliance. The meeting also informed that the Alliance, as a social organization, joined the China Storage Industry Alliance on October 26. As the vice-director unit of the China Storage Industry Alliance, the Alliance will play an active role in promoting in-depth cooperation between materials & components enterprises, storage manufacturing enterprises and research institutions, and in building the supply chain of materials and components.
The meeting considered and voted through the membership application made by Xiamen Jiguang Integrated Circuit Technology Co., Ltd., Air-sys Refrigeration Engineering Technology (Beijing) Co., Ltd., Chengdu Kemeite Special Gas Co., Ltd., Suzhou Xinhao New Materials Co., Ltd., Shanghai Dazu Fuchuangde Technology Co., Ltd., Chongqing Tonghui Gas Co., Ltd., Henan Xinlianxin Shenleng Energy Co., Ltd., Pureach Technology (Beijing) Co., Ltd., Shengjisheng (Ningbo) Semiconductor Technology Co., Ltd., Shanghai Core Carving Micromaterials Technology Co., Ltd., Wuxi Chuangda New Materials Co., Ltd., and Shanghai Weisong Industrial Automation Co., Ltd.
Finally, the delegates held a heated discussion on the development of the Alliance, related issues and the work arrangement for the second half of 2018, affirmed the achievements of the Alliance in recent years, and suggested that the Alliance help enterprises seize various development opportunities, strengthen the docking with customers and suppliers, develop differentially, strengthen peer cooperation and improve the ability of jointly tackling key problems. The delegates also advocated mutual help and mutual learning, in order to jointly overcome more difficulties in the field of materials and components in integrated circuit manufacturing industry, and strive for more international market positions.