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The 2nd General Meeting of the Integrated Circuit Materials & Components Industry Technology Innovative Alliance was held in Bei

The 2nd General Meeting of the Integrated Circuit Materials & Components Industry Technology Innovative Alliance was held in Bei

Source:
2015/03/31
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  On February 10, 2015, the 2nd General Meeting of the Integrated Circuit Materials & Components Industry Technology Innovative Alliance was held in Beijing. Leaders and experts such as Ye Tianchun, Leader of National Science and Technology 02 Major Project and Director of Institute of Microelectronics of Chinese Academy of Sciences and Academician Wang Xi, Deputy Leader of National Science and Technology 02 Major Project, attended the meeting and delivered speeches. Ms. Shi Ying, Secretary General of the Alliance, presided over the meeting and made a work report. More than 70 representatives from the member units of the Alliance attended the meeting.

  The remarkable results achieved by the Alliance in facilitating the supply and demand cooperation in the integrated circuit materials industry in the past two years, supporting the work of National Science and Technology 02 Major Project and government departments, organizing industry forums and academic and industrial exchange activities, exploring cooperation path of the Alliance and international organizations and enterprises, studying the development roadmap of materials industry and the construction of the Alliance itself, as well as the research and discussion of work priorities in the future were fully affirmed in the meeting. The proposals such as “advanced packaging material application verification platform established by the Materials Alliance relying on National Center for Advanced Packaging Co., Ltd.”, “employment of Academician Wang Zhengping and Dr. Lin Qinghuang as special advisors of the Alliance” and “first amendment to the agreement of the Integrated Circuit Materials & Components Industry Technology Innovative Alliance” were reviewed and approved in the meeting, the work program of 2015C-MRS microelectronics and optoelectronics parallel session and the work plan and activity arrangement of organizing the planarization technology Alliance (CMPUG-CHINA) were discussed in the meeting.

  The second council consisting of 49 council members was elected in the meeting, Academician Wang Xi, was elected as the Chairman of the Alliance; Wu Hanming, Vice President of R&D of SMIC Integrated Circuit Manufacturing Co., Ltd., Li Qi, Deputy General Manager of Shanghai Huahong Grace Electronics Co., Ltd., Zhou Qigang, Director of Grinm Semiconductor Materials Co., Ltd., Yao Lijun, Chairman of Ningbo Jiangfeng Electronic Materials Co., Ltd., and Sun Jiangyan Chief Engineer of Shanghai Sinyang Semiconductor Materials Co., Ltd., were elected as Vice Chairman; Wang Shumin, Chairman of Anji Microelectronics (Shanghai) Co., Ltd., Chen Xin, Chairman of Beijing Kempur Microelectronics Materials Co., Ltd., Wang Shaobo, Deputy Director of 718th Institute of China Shipbuilding Industry Corporation, Zheng Kangding, Chairman of Ningbo Kangqiang Electronics Co., Ltd., Yang Zhicheng, General Manager of Shennan Circuit Co., Ltd., Feng Qili, Chairman of Jiangsu Zhongpeng New Materials Co., Ltd., Zheng Hongyu, Deputy Director of Hebei Sinopack Electronic Technology Co., Ltd., and Shangguan Dongkai, Chairman of National Center for Advanced Packaging Co., Ltd., were elected as the managing directors; and Ms. Shi Ying was elected as the Secretary General of the Alliance.

  Ye Tianchun, Leader of National Science and Technology 02 Major Project and Director of Institute of Microelectronics, Chinese Academy of Sciences highly praised the achievements made by the Materials Alliance and said that the group will greatly promote the development of the materials industry and will continue to support the work of the Alliance. He also hoped that the Materials Alliance can give full play to its advantages to actively provide professional advice to financial investment institutions such as the National Fund, and use and integrate existing resources to build a shared platform to support technological innovation in the materials industry. At the same time, he also took advantage of the material enterprises to seize the golden development opportunity period of China's integrated circuit industry in the next 5-10 years, and make good use of the good ecology of the "three-chain integration" of industry chain, innovation chain and financial chain to jointly contribute to build the flagship type of the material industry.

  Academician Wang Xi, Chairman of the Alliance, conveyed the spirit of the leadership of the State Council on doing a good job in the National Science and Technology Major Project. At the same time, he also asked the Alliance to carry forward the existing work characteristics and focus on cooperation with the National IC Industry Investment Fund Co. Ltd. to promote the integration of integrated circuit materials industry, and make breakthroughs in building large enterprises in key areas. He also hoped that the Alliance will play a supporting role in the development and management of technology and industrial development related to integrated circuit materials in addition to National Science and Technology 02 Major Project.