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Linking global intellectual resources to boost China's material development – Intelligence Coordination Meeting of IC Materials

Linking global intellectual resources to boost China's material development – Intelligence Coordination Meeting of IC Materials

Source:
2015/04/20
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  The “Intelligence Coordination Meeting of IC Materials Industry” sponsored by the Integrated Circuit Materials & Components Industry Technology Innovative Alliance (hereinafter referred to as the "Materials Alliance") was held in Shanghai on March 16, 2015. With the theme of “Linking global intellectual resources to boost China's material development”, the latest technological advances in the field of integrated circuit materials, the development opportunities of China's integrated circuit materials industry, and the prospects for mutual benefit and cooperation were discussed in the meeting. More than 100 experts from IC materials and related fields at home and abroad including Ye Tianchun, Leader of National Science and Technology 02 Major Project and Director of Institute of Microelectronics, Chinese Academy of Sciences, Academician Wang Xi, Deputy Leader of National Science and Technology 02 Major Project, Chairman of the Materials Alliance and Director of Shanghai Institute of Microsystems of the Chinese Academy of Sciences, Wang Zhengping, Academician of the American Academy of Engineering, and Foreign Academician of the Chinese Academy of Engineering and Director and Professor of the Georgia Institute of Technology, Dr. Lin Qinghuang, Watson R&D Center of IBM in New York, and more than 20 overseas experts, more than representatives of Alliance member units, and some of the National Science and Technology Major Project experts participated in the meeting.