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The First Meeting of 200mm Silicon Wafer Synergy Promotion was held in Shanghai

The First Meeting of 200mm Silicon Wafer Synergy Promotion was held in Shanghai

Source:
2015/05/20
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  In order to speed up the technical upgrade of the domestic 200mm silicon wafer industry, entrusted by National Science and Technology 02 Major Project group, the Integrated Circuit Materials & Components Industry Technology Innovative Alliance prepared and set up the "working group of mass production application promotion for domestic 200mm wafer". The mission of the working group is to coordinate the National Science and Technology 02 Major Project of silicon materials project and the procurement progress of 200mm engineering silicon wafers for integrated circuit materials mass production application, so as to ensure the achievement of the goal.

  On May 13, 2015, the working group held the “First Meeting of 200mm Silicon Wafer Synergy Promotion” at Shanghai Huahong Hongli Semiconductor Manufacturing Co., Ltd. Ye Tianchun, 02 Leader of National Science and Technology 02 Major Project, and Academician Wang Xi, Deputy Leader of National Science and Technology 02 Major Project and Director of Institute of Microsystems of Chinese Academy of Sciences, attended the meeting and delivered speeches; Zhang Xin, Xiao Sheng’an and Jiang Juncheng, Special Responsibility Experts of National Science and Technology 02 Major Project, attended the meeting and provided technical guidance. Shi Ying, Secretary General of the Integrated Circuit Materials & Components Industry Technology Innovative Alliance, presided over the meeting. The companies attending this conference include Huahong Grace, China Resources Microelectronics, SMIC, Zhejiang Jinruihong, Grinm Semiconductor, Shanghai Simgui, Nanjing Guosheng, Hebei Puxing and Tianjin Huan’ou.

  At the meeting, all integrated circuit manufacturing companies and silicon wafer manufacturers reported their respective task progress in National Science and Technology 02 Major Project, and raised the difficulties encountered in the implementation of current project. After listening to the reports from all units, Ye Tianchun, Leader of National Science and Technology 02 Major Project group said that “quality control of products is the key to project implementation. Only under the premise of ensuring quality assurance, manufacturers can confidently promote customers to use domestic silicon wafers. It’s advised that the Alliance take the lead to conduct a seminar."

  Through the group discussion of various wafer manufacturers and manufacturing companies, the stage work objectives and progress nodes were formed, and the working mechanism of the working group was determined. Academician Wang Xi, Deputy Leader of National Science and Technology 02 Major Project, made a concluding speech on this meeting, and conveyed the spirit of the leaders of the State Council on the acceptance of the national science and technology major projects, hoping that all the companies present here can work closely together to complete the National Science and Technology Major Project on silicon materials and mass production application engineering project tasks of 200mm integrated circuit materials. At the same time, he also hoped that the Alliance can promote various materials manufacturers to make full use of the "big fund" platform of national integrated circuit, and make China's integrated circuit localization business bigger and stronger.