From April 20 to 25, 2014, Academician Wang Xi, Chairman of the Integrated Circuit Materials & Components Industry Technology Innovative Alliance led 12 member units to Japan for investigation. Meanwhile, the Alliance and Japan-China Friendship Exchange Promotion Association jointly sponsored the "4th Japan-China Electronic Materials Technology Exchange Conference", and successively visited the headquarters of 6 enterprises including School of Engineering of University of Tokyo (FUJIFILM), Toppan Printing Co. Ltd., Tokyo Ohka Kogyo Co., Ltd., Tokyo Electron Ltd, Disco Technology and Mitsubishi Chemical, and held 3 sessions of cooperation and exchange meetings with RS Technology, SEAJ, SEMI Japan, etc.
