International Symposium on Advanced Packaging Materials (APM) is the most important technical seminar for electronic packaging and materials in the world. The symposium aims to provide an important platform for experts, scholars and scientists in the academic and industrial circles at home and abroad to exchange new developments and new ideas in electronic packaging technology and materials.
From March 13 to 14, 2016, the 2016 International Symposium on Advanced Packaging Materials (APM) was held at the Shanghai International Convention Center. This symposium was organized by the ICMtia, SEMI China and US IEEE/CPMT. The world-renowned experts in electronic packaging technology and materials, including Professor Wang Zhengping (Director and Professor of Georgia Institute of Technology, Chief Scientist of the "Advanced Electronic Packaging Materials" innovation team in Guangdong Province, and specially-invited expert of ICMtia), Dr. Liu Hancheng (Senior Scientist of ASMPT), Professor Li Shiwei (Hong Kong University of Science and Technology), Professor Katsuaki Suganuma (Osaka University, Japan), Dr. Takeshi Mori (Sumitomo Co., Ltd.), Professor Liu Jianying (Chalmers University of Technology, Sweden), were specially invited to the symposium to make special reports. The symposium received 51 contributions from well-known universities, research institutions and enterprises around the world, including 22 oral reports and 29 wall papers. At the same time, it attracted nearly 100 experts, scholars and business people from China, South Korea, Japan, Germany, the United States, Taiwan and Hong Kong to participate in the symposium. Dr. Chen Tian’an, made a speech, and Dr. Chen Tian’an, Tan Xiaohua, General Manager of Tianjin Tecore Synchem Company, Dr. Zhang Xinhong, Nantong Fujitsu and Dr. Zhang Guoping, Shenzhen Institutes of Advanced Technology，Chinese Academy of Sciences, presided over the symposium respectively.
Subsequently, hot exchanges and discussions on topics such as advanced semiconductor electronic materials, micro-nano electronic packaging materials, advanced electronic packaging technology, including package reliability and thermal solutions, were conducted in the symposium, providing a platform of mutual exchanges for scholars and business people at home and abroad.