The national “Twelfth Five-Year” Science and Technology Achievement Exhibition with the theme of “innovation-driven development and technology-led future” was held in Beijing Exhibition Hall from June 1 to 7. The material enterprises including Jiangfeng Electronics, Anji Microelectronics, Beijing Kempur, Grinm Semiconductor, Tianjin Huan’ou, Nanjing Guosheng, Shanghai Simgui, Nata Optoelectronics, Darbond Technology, Jiangsu Zhongpeng, Shennan Circuit, Xingsen Kuaijie, Danbond Technology, Hebei Sinopack, Ningbo Kangqiang, and Grikin participated in the exhibition of National Science and Technology 02 Major Project exhibition area.
Under the support and guidance of National Science and Technology 02 Major Project, the overall technical level of the integrated circuit and advanced packaging materials industry has been greatly improved, and the application technology node of the main material reaches 90-65 nm. Some products such as sputtering target, CMP polishing liquid, electronic gas, and process chemicals can meet the 28-nm process requirements. The ICMtia coordinated with the implementation of National Science and Technology Major Project to promote the mass production application of domestic materials, and hundreds of materials were sold in batches. The procurement ratio of 19 materials exceeded 50%. The 8-12 major manufacturing plants in the domestic have purchased more than 1.2 billion yuan of domestically produced materials, including CMP copper polishing fluid, bismuth target and components. The total purchase amount of single material is more than 50 million yuan, and the cumulative purchase amount of NF3 and CMP barrier polishing fluid, etc., reached 200 million yuan. Major materials companies have applied for 3,574 invention patents, among which 1422 invention patents have been authorized.