The International Conferenceon Planarization/CMP Technology (ICPT) was successfully held at Beijing Friendship Hotel on October 17-19, 2016. ICPT is the largest and most attended international event in the field of flattening. It is held annually in six countries or regions including the United States, Europe, Japan, South Korea, Taiwan, and China. This year is the first time ICPT is in China. Hosted by the mainland. The conference was co-sponsored by China Flat Technology Alliance and Beijing Multidimensional Electronic Materials Technology Development and Promotion Center, IEEE Beijing Branch Technology and Publishing Support, China Semiconductor Industry Association, Integrated Circuit Materials and Components Industry Technology Innovation Strategic Alliance, and China Machinery Co-organized by the Engineering Society Tribology Branch.
This conference is a grand meeting of international exchange of chemical mechanical polishing (CMP) and flattening technology. It is a grand meeting of cooperation and exchange between flat technology and industrial chain in micro-nano electronics and precision manufacturing. The chairman of the conference is Professor Xinhua of Tsinghua University. The chairman of the program committee is Professor Qu Xinping from Fudan University. The chairman of the sponsorship committee is Dr. Wang Yuchun from Anji Microelectronics. The Secretary-General of the conference is Ms. Shi Wei, Secretary-General of the Strategic Innovation Alliance for Integrated Circuit Materials and Components Industry.
Researchers and engineers from all over the world come together to discuss key issues in the flattening process and conduct extensive technical exchanges and information sharing. There were about 400 participants in the conference, and more than 200 of them were experts and scholars from the United States, Europe, Japan and South Korea. Participants mainly came from companies and universities and research institutes in the fields of equipment, materials, and crafts in the flattening process, including authoritative representatives of companies and universities, such as Levitronix, Applied Materials, Ebara, Entegris, Cabot, Fujimi, International companies and institutions such as Clarkson University, and domestic enterprises and institutions such as TSMC, SMIC, Huali Microelectronics, Huahai Qingke, Anji, Tsinghua, and Fudan.
The opening ceremony of the conference was chaired by Shi Wei, Secretary-General of China Flat Technology Alliance, Secretary-General of the Technology Innovation Strategy Alliance of Integrated Circuit Materials and Components Industry, and Vice Chairman of China Semiconductor Industry Association, Ye Sweetou, Director of Microelectronics Institute of Chinese Academy of Sciences, and Chairman of the conference. The chairman of the China Flat Technology Alliance and the professor of Tsinghua University, Lu Xinchun, gave wonderful speeches. Next, the conference was divided into 8 seminars, including 3 keynote reports and 10 invitation reports, and invited senior experts in the field of international flattening to discuss. The keynote speakers include TzuChiangYu, vice president of SMIC, TSMC Director ChrisChern, and Ebara's company CTOManabuTsujimura, invited the reporters from Applied Materials, Globalfoundries, Toshiba, Samsung, SKHynix, Hanyang University, IMEC, LETI, Huali Microelectronics, and Northeastern University. In addition, it includes 33 oral reports and 71 posted reports. The conference maintained a fine tradition of ICPT. 30 posters were selected for a three-minute short oral report at the conference, and then posted. Participants conducted extensive and in-depth technical exchanges on CMP applications in semiconductors, emerging CMP and integration, CMP defects, cleaning, modeling, CMP mechanism research, CMP equipment, consumables, CMP in 3D integration, and many other cutting-edge issues. discuss. After the selection of the program committee, three outstanding student report awards were presented at the closing ceremony of the conference. The winners were Rao of the Department of Mechanical Engineering of Tsinghua University, Yang Guang of the Institute of Microelectronics of Fudan University, and the Materials Department of the ERICA Campus of Hanyang University, Korea. Kwang-MinHan. With the rapid development of China's IC technology and the establishment and growth of the National Integrated Circuit Industry Investment Fund, the integrated circuit industry in the mainland has been advancing rapidly and its comprehensive strength has been significantly improved. After the meeting, the members of the International Executive Committee of the conference expressed their great pleasure to see that there are so many R&D personnel and engineers in the CMP field in China. The high-level report, good organization and hospitality of the conference made the meeting very successful. By holding this conference, we expect more research and development personnel in the CMP field to have a far-reaching cooperation. China's influence and voice in the field of international integrated circuits, especially in the field of flattening, will be further enhanced.
Secretary-General of the China Flatness Technology Alliance, Secretary-General of the IC and Technology Industry Innovation Strategy Alliance for Integrated Circuit Materials and Components Industry
Speech by Ye Tianchun, Vice Chairman of China Semiconductor Industry Association and Director of Microelectronics Institute of Chinese Academy of Sciences
Chairman of the conference, Chairman of China Flat Technology Alliance, and Professor Tsinghua University’s speech
Three "Best Student Paper Awards" winners and the winners
(From left: Professor Xinhua from Tsinghua University, Professor Chen Yuzhang from Taiwan University of Science and Technology, Rao Yu from Tsinghua University, Kwang-MinHan from Hanyang University, Yang Guang from Fudan University, Professor Qu Xinping from Fudan University, Professor Syuhei Kurokawa from Kyushu University, Japan)
Part of the participants at the closing ceremony