On May 16, 2017, the 2017 Integrated Circuit Polishing Materials Industry Roadmap Working Group Meeting organized by the Integrated Circuit Materials & Components Industry Technology Innovative Alliance (hereinafter referred to as the “Alliance”) was successfully held in Beijing.
More than 10 people including Shi Ying, Secretary General of the Alliance, Luo Kai from Anji Microelectronics (Shanghai) Co., Ltd. and representatives of roadmap working group from Shanghai Xinanna Electronic Technology Co., Ltd., Ningbo Jiangfeng Electronic Materials Co., Ltd., Hubei Dinglong Chemical Co., Ltd., Shenzhen Songyang Microelectronics Technology, Chengdu Times Lives Technology Co., Ltd. and Hebei University of Technology attended the meeting. The participants discussed the technical development, product mix, market expansion, talent planning and difficulties faced by CMP polishing materials in the next 5 to 10 years. The framework for patent analysis in the field of CMP materials conducted by the Alliance Secretariat was discussed in the meeting.
Shi Ying, Secretary-General of the Technology Innovation Strategic Alliance of the Integrated Circuit Materials and Components Industry, presided over the meeting and delivered a speech
Luo Kai, leader of the road map working group, introduced the preliminary results of the roadmap
meeting venue