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2017 China Planarization Technology Conference & Cross-Strait Planarization Technology Forum was held in Dalian, China

2017 China Planarization Technology Conference & Cross-Strait Planarization Technology Forum was held in Dalian, China

Source:
2017/05/31
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Organized by the Flattening Technology Alliance and the Friction Society Micro-Nano Manufacturing Tribology Professional Committee, Dalian University of Technology hosted the "2017 China Flattening Technology Conference and Cross-Strait Flattening Technology Forum" from May 22nd to 23rd at Dalian Institute of Technology. The university is held. From Tsinghua University, Taiwan University, Dalian University of Technology, Taiwan University of Science and Technology, Southwest Jiaotong University, Qinyi University of Science and Technology, Hebei University of Technology, Tamkang University, Huaqiao University, National University of Defense Technology, Nanjing University of Aeronautics and Astronautics, Guangdong University of Technology, Fujian 121 people from 22 colleges and 26 enterprises across the Taiwan Strait, including Jingan Optoelectronics, Intel (Dalian), Huahai Qingke, Jiabo Microelectronics Materials Co., Ltd. and Linxconsulting, attended the conference.

  

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The opening ceremony of the conference was presided over by Professor Kang Renke of Dalian University of Technology. Professor Jia Zhenyuan, Vice President of Dalian University of Technology, delivered a speech at the opening ceremony. Chairman of the Organizing Committee of the Cross-Strait Flattening Technology Forum, Professor Lu Xinchun from the National Key Laboratory of Tribology of Tsinghua University, and Vice Chairman of the Conference, Professor Chen Yuzhang, Chairman of the Board of Directors of Taiwan Flattening Application Technology Association I gave a speech and expressed warm congratulations on the convening of the meeting.
 
With the rapid development of semiconductor manufacturing technology, flattening technology will still be one of the core technologies of integrated circuit manufacturing. China has made great progress in flattening technology and has received important attention from the academic and industrial circles in the world. This meeting is of great significance to promoting China's exchanges between industry and academic circles in this field and across the Taiwan Straits.
 
The meeting was awarded by Tianjin Huahai Qingke Electromechanical Technology Co., Ltd. (Gold), Hebei University of Technology (Gold), Olympus (China) Co., Ltd. (Gold), 3Msicence (Gold), Beijing Tesidi Equipment Manufacturing Co., Ltd. (Silver) ) and sponsored by Chengdu Times Lifu Technology Co., Ltd. (Silver).

  

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This technical forum invited Professor Chen Yuzhang from Taiwan University of Science and Technology, Professor Liu Yuling from Hebei University of Technology, Dr. Zhao Dewen from Tianjin Huahai Qingke Electromechanical Technology Co., Ltd., Associate Professor Zhou Ping from Dalian University of Technology, Dr. Wang Ke, Director of CMP Technology of Dalian University of Technology, Dalian, and Southwest Jiaotong University. Professor Lin Mao and Dr. Wu Guojun, Director of Technology Development of Taiwan Jiabo Microelectronics Materials Co., Ltd., and other 15 experts made a report on the invitation of the conference.

  

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The seminar provided valuable exchange opportunities for the delegates. The delegates conducted a full discussion on the research status, challenges, development trends and application areas of the flattening technology at home and abroad. The success of the conference promoted the two sides of the Taiwan Straits. Inter-exchange.