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The main plant of Tacoma Semiconductor in Huai'an was completed, Secretary General Shi Ying attended the ceremony

The main plant of Tacoma Semiconductor in Huai'an was completed, Secretary General Shi Ying attended the ceremony

Source:
2017/06/23
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On the morning of June 21, the main plant capping of Tacoma Semiconductor in Huai'an and the opening ceremony of design and R&D center was held in Huaiyin District, marking that the project has entered a new stage of construction and R&D. It also laid a solid foundation for putting into operation and achieving capacity for the next step. Shi Ying, Secretary General of the Integrated Circuit Materials & Components Industry Technology Innovative Alliance (hereinafter referred to as the “Alliance”), Cai Lixin, acting Mayor of Huai'an City, and Gu Kun, vice mayor, etc., Xia Shaozeng, Chairman of Huai'an Tacoma Semiconductor Co., Ltd., and representatives from the construction party and cooperation partners attended the ceremony.

It is reported that Huai'an Tacoma project has a total investment of 15 billion yuan, and the first phase is the factory with an annual output of 240,000 12-inch semiconductor chip wafers. The project is mainly oriented to the design and manufacture of self-designed image sensor chips. After completion, it will fill the gaps in the design and manufacturing of independent sensor chips in China. In the future, the project will implement the development strategy of “two bases, one institute and two centers” by focusing on the construction of 12-inch wafer fabrication base in Huai'an, and finally realize the IDM industry layout integrated by manufacturing, design, service and sales of semiconductor CIS in Huai'an.

Xia Shaozeng, Head of Huai'an Tacoma Semiconductor, said that China is the world's largest consumer of chips. Image sensor (CIS) is the only product with the annual market sales volume more than $10 billion except for CPU and memory, as well as product with the fastest growing market in the next five years. It’s widely used in consumer electronics and industrial electronics such as smart phones, smart cars, AR/VR, UAVs, robots, Internet of Things, security surveillance, and sports cameras.