Secretary-General Shi Jie presided over the meeting
Board of Directors voted on the scene
On the afternoon of August 17, 2017, the seven session of the 2nd council meeting of the Integrated Circuit Materials & Components Industry Technology Innovative Alliance (hereinafter referred to as the “Alliance”) was successfully held in Ningbo. More than 180 people including the Secretary General, Vice Chairman, Executive Director, representatives of member units and newly applied units attended the meeting.
Secretary General Shi Ying presided over the meeting and made a summary of the progress made by the Council in the first half of 2017 and a report on the work plan for the second half of the year. Specialized work specialists made detailed reports on supplier pre-assessment, 2017 C-MRS microelectronics and optoelectronics parallel session work, materials and components roadmap work progress, group standardization work progress, website product promotion program of the Alliance, and materials and components supply chain conference plan. The achievements and progress made by the Alliance in supporting the materials and components sector of National Science and Technology 02 Major Project, organizing industry and academic exchange activities, initiating enterprise quality improvement projects, intellectual property research progress, data collection and industrial operation analysis, launching group standardization, and continuous promotion of supply and demand cooperation in the industrial chain, and image promotion, were confirmed and the work in the second half of 2017 was discussed in the meeting.
The addition of Wang Zhiyue (Chief expert of CEC Electronic Equipment Group Co., Ltd., and National Science and Technology 02 Major Project group expert), and Huang Picheng (Vice President of US PALL Company, and Chairman of Technical Committee of China International Semiconductor Materials Seminar) as expert advisory committee experts, addition of Li Shaoping from Hubei Xingfu Electronic Materials Co., Ltd. as the Director of the Alliance, change of Ni Lihua to the council member representative of Shanghai Huali Microelectronics Corporation, change of Wang Su to the council member representative of Shanghai Sinyang Semiconductor Materials Co., Ltd., and pass of the composition of Alliance group standards committee were reviewed and approved in the meeting. The application of joining the Alliance from a total of 18 companies including Nanjing Sanchao Advanced Materials Co., Ltd., Shanghai Jiaguan Semiconductor Technology Co., Ltd., Xiamen Kehua Hengsheng Co., Ltd., Shanghai Gaosheng Integrated Circuit Equipment Co., Ltd., Lianyungang Huide Quartz Glass Co., Ltd., Qyzhou Hangyang Gas Co., Ltd., Shanghai Feilihua Shichuang Technology Co., Ltd., Shandong Haike Holdings Co., Ltd., Raenin High-tech Materials (Zhangzhou) Co., Ltd., Shanghai PhiChem Photoelectric Materials Co., Ltd., Jiangsu Teng’ao Electronic Technology Co., Ltd. Dalian Special Gas Co., Ltd., Yantai YesDo Electronic Materials Co., Ltd., Guangdong Xiandao Tin Materials Co., Ltd., Wuxi DK Electronic Materials, Inc., Jiangsu Dynamic Chemical Co., Ltd., Fujian Deer Technology Co., Ltd., and Cangzhou Sunheat Chemicals Co., Ltd., were reviewed and voted in the meeting.
The participating representatives conducted hot discussion on the work in the second half of 2017 and hope the Alliance would organize the semiconductor materials and components supply chain conference and plan more communication with government departments, user units and overseas enterprises to promote further cooperation. After the meeting, all the representatives participated in the “Special Project Achievements in Ningbo & launching ceremony of Ningbo (China) Xingang Town” held by the Alliance and the Ningbo Municipal People's Government.