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Huahai Chengke: the first brand of electronic packaging materials

Huahai Chengke: the first brand of electronic packaging materials

Source:
2018/09/24
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Jiangsu Huahai Chengke New Material Co., Ltd. is a high-tech enterprise specializing in R&D, production, sales and technical services of semiconductor packaging materials. The company has one internationally advanced epoxy plastic sealing material pilot production line and two large production lines, the existing production capacity of 10,000 tons / year, and built a new electronic packaging materials research center, with strong research and development strength and perfect Test means. The company's products cover semiconductor device packaging materials, large-scale / ultra-large scale / very large scale integrated circuit materials, special motor packaging materials, LED packaging materials, etc., and has a one-stop package that integrates product testing, application, assessment and technical services capabilities.
 
In the past two years, the company has developed more than 20 new products with a strong R&D team and strong technical force. It has mastered the core technology with independent intellectual property rights and has 16 patents. The newly developed MIS packaging plastic packaging material, QFN molding material, white epoxy resin sealing material for LED bracket (the only one in China) and other new products, the technology level has reached international advanced, leading the country. While focusing on the development of new products and new technologies, the company actively promotes the transformation of results and increases market development. The company's 2013 sales revenue increased by 165% compared with the previous year, and the planned sales revenue in 2014 increased by 88% year-on-year.
 
Based on its own advantages, the company will continue to carry out scientific and technological innovation and market development with perfect team, leading technology and advanced manufacturing equipment. It plans to expand the production capacity of epoxy molding compound to 20,000 tons/year in the next 3 years. The first brand of microelectronic materials has become a world-class supplier of microelectronic materials. (From Jiangsu Huahai Chengke New Materials Co., Ltd.)