Jiangsu Zhongpeng New Materials Co., Ltd. is an electronic packaging material manufacturer integrating scientific research, production and sales. It is one of the largest R&D and production bases of Chinese-fashioned epoxy molding compound and phenolic molding compound. At present, the company ranks second in the same industry in China, and the Chinese enterprises rank first in the country.
Zhongpeng New Materials Epoxy Molding Compound has an annual production capacity of 14,000 tons. The products are mainly used in semiconductor discrete devices, power devices, special devices, large scale and large scale such as Doid, TO, DIP, SOT, SSOP, LQFP, DFN, QFN, BGA. Primary package of scale integrated circuits. Phenolic molding compounds are mainly used in coil bobbins, commutators, carbon brush holders, switches, capacitors, terminal blocks, automotive electronics and other packaging.
The company has a provincial-level R&D center. The center has a modern international level of technology development and testing equipment. It has a leading domestic pilot production line, a provincial post-doctoral research station, a skilled R&D team, and the Institute of Chemistry of the Chinese Academy of Sciences. Nanjing University has carried out the cooperation of industry, university and research institutes, and has built a research and innovation platform with a leading domestic level.
In recent years, the company has undertaken more than 20 national and provincial science and technology projects, including 3 major national special projects, 1 special project for the transformation of scientific and technological achievements in Jiangsu Province, and 2 national semiconductor innovation products, 6 Jiangsu high-tech products.
In the future, Zhongpeng New Materials will continue to adhere to the innovative concept and strive to realize the vision of “world-class semiconductor packaging material supplier” as soon as possible. (From Jiangsu Zhongpeng New Materials Co., Ltd.)