Established in 2003, Yantai Darbon Technology Co., Ltd. is a high-tech enterprise with a strong technical expert team and a high degree of independent innovation. It is committed to professional R&D, production and sales of special functional polymer interface materials for industrial and electronic applications. The company has established a post-doctoral workstation, provincial academician workstation, provincial international scientific and technological cooperation research center, provincial microelectronic packaging materials and system integration engineering technology research center and other scientific research platforms, and has won the "100 Most Entrepreneurial Potential Enterprises" ", "Overseas Chinese Key
Entrepreneurship Team" and many other awards.
Entrepreneurship Team" and many other awards.
The company has continuously increased investment in science and technology innovation and encouraged employees to innovate. Up to now, it has nearly 70 national invention patents, and the “Darbon” trademark has won the famous trademark of Shandong Province. The company has undertaken the National 863 Program, the National Major Science and Technology Special Project (02 Special Project), the National SME Innovation Fund, the International Cooperation Project, the Provincial Science and Technology Innovation Project and the Industrialization Project, etc., which are key in the wind energy, LED industry and high-density semiconductor packaging. Key developments in the development and industrialization of supporting materials have been made to replace foreign imports. At present, Darbon products application areas include semiconductor packaging and assembly, information systems and terminals, new displays, LEDs, new energy (wind energy, solar energy), etc. Some products directly challenge international famous brands and replace foreign imports.
At present, the first phase of the Darbon New Materials Industrial Park has started construction, in order to fill the domestic gap and enter the international competition in the fields of conductive chip glue, thermal interface materials, underfill, various UV curing, bonding materials and LED materials for semiconductors. Facing the future, the company will continue to increase investment in scientific research, improve overall management level and competitiveness, and make positive contributions to the country's new material strategy. (From Darbon Technology Co., Ltd.)