On April 13, 2021, the packaging materials seminar jointly sponsored by the Integrated Circuit Material Industry Technology Innovation Alliance (hereinafter referred to as the "Alliance") and JCET Group was successfully held in Jiangyin City.

The purpose of this seminar is to intensify cooperation between supply and demand parties and promote collaboration on the application. Featuring the packaging materials professional sector, it promotes the new needs and challenges of materials by discussing the problems in the mass production of materials and the development of advanced packaging technology, form an innovative mechanism for the coordinated development of upstream and downstream, and accelerate the promotion of localized mass production and application of packaging materials.

Meeting Summary：

Chief Executive Officer Zheng Li, Executive Vice President Luo Hongwei, Vice President Ren Xia, and other management teams, as well as technical personnel in supply chain, engineering technology, and R&D departments, had in-depth and detailed exchanges and interactions with representatives of the alliance packaging materials companies.A total of more than 70 representatives from 21 packaging material manufacturers attended this meeting and conducted group exchanges with JCET Group.