Because the Chemical Mechanical Planarization (CMP) technology is now being extensively used in semi-conductor techniques and ultra-precise manufacturing. As the critical dimension in semiconductor manufacturing continues to narrow down and as ultra-precise processing technology develops, the importance of CMP technology becomes more evident, which is confronted with multiple technical challenges, e.g., technologies, key equipment and materials. The industrial technology development requires close cooperation along the entire industrial chain consisting of technology, equipment and materials. On the other side, the International Conference on Planarization Technology, ICPT is also partnering with CMP Users Groups in major countries and regions to promote CMP technical exchanges, promotion and applications. To better integrate China’s CMP technical development into the international ICPT organs, the Planarization Technology Alliance (hereinafter referred to as the Alliance)is established voluntarily by 26 companies, institutions, universities and research institutes that are dedicated to planarization technology. The Alliance is jointly initiated by China Semiconductor Industry Association, MNM Tribology of China Mechanical Engineering Society, and ICMTIA.