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Huahong Grace

Huahong Grace

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On February 25, 2014, the launching of “Mass Production Application Engineering of National Integrated Circuit Key Equipment and Materials” project & Huahong Grace Materials Supply and Demand Matchmaking Meeting was successfully held in Shanghai. Academician Wang Xi, Chairman of the Integrated Circuit Materials & Components Industry Technology Innovative Alliance, attended the meeting and delivered a speech. Xu Wei, Executive Vice President and Li Qi, Vice President of Shanghai Huahong Grace Semiconductor Manufacturing Co., Ltd., Su Wei, General Manager of China Resources Shanghua, and the heads of materials procurement, application evaluation and quality management of the three major factories of Huahong Grace and more than 100 responsible persons from the technical, quality and market sales in the member units of the Materials Alliances attended the meeting. Shi Ying, Secretary General of the Materials Alliance, presided over the meeting.

 

The implementation plan of the “Mass Production Application Engineering of National Integrated Circuit Key Equipment and Materials” project was announced, and the requirements of Huahong Grace and China Resources Shanghua for domestic materials certification process and technical and quality control were notified in the meeting, and the issues of domestic 8-inch IC material verification process and the next action plan were discussed in groups. The “Mass Production Application Engineering of National Integrated Circuit Key Equipment and Materials” project was jointly planned by the Materials Alliance and Huahong Grace, which has been approved as the National Science and Technology 02 Major Project. The overall goal of the project is to support and encourage domestic chip manufacturers and chip users to accept and adopt domestically produced materials to achieve mass production of materials and promote the bulk procurement and application of domestic materials, so as to achieve the same level of international standards, and participate in international competition. It is estimated that from 2014 to 2016, the evaluation to 22 products including epitaxial wafers, SOI, FZ wafers, and LowCOP polishing wafers from 6 wafer manufacturers, 8 products from 4 special gas manufacturers, 12 varieties from 5 chemical manufacturers, and precious metals such as titanium targets, aluminum targets, gold and silver will be completed, achieving a total purchase amount of 520 million yuan. The current situation of the domestic integrated circuit materials industry was analyzed in the meeting, which pointed out many problems in the industry and the severe situation faced, such as the huge workload on evaluation, high evaluation cost, low confidence in chip users and companies, disadvantageous price, high cost and high risk of mass production. The supplier certification procedures, quality review procedures, technical evaluation procedures, and management measures for suppliers of Huahong Grace and China Resources Shanghua were also introduced in the meeting.

 

Xu Wei, Executive Vice President of Huahong Grace, said: "Today's meeting opened the prelude of Shanghai Huahong Grace Semiconductor Manufacturing Co., Ltd. to lead domestic semiconductor companies to further promote the cultivation of local suppliers. After the matchmaking meeting, we will face many opportunities and challenges. We and materials companies will not only face the problems of stability of materials, but also the monopoly of foreign suppliers and the threshold of customers. However, I am confident that through the “Mass Production Application Engineering of National Integrated Circuit Key Equipment and Materials” project, we will face difficulties and bottlenecks together with materials companies and end customers, and jointly draw a blueprint and roadmap for mass production application engineering of 8-inch domestic materials. I always believe that we Chinese people can do it if foreigners can do it, and we can even do it better!"

 

Shi Ying, Secretary General of the Materials Alliance, said: "The event aims to accelerate the mass application of domestic materials for integrated circuits, enhance the comprehensive competitiveness of materials companies, and promote the consensus between supply and demand sides and end users in promoting mass production application of materials, implement the plan and promote the work in a coordinated manner."

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